Leading-Edge Electronic Materials of
JX Advanced Metals Group

Products and Services

You can search for the product you are looking for by application.

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  Sputtering Targets for Magnetic Devices

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  Sputtering Targets for Semiconductors
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  AMtrinsic^® Powders for Additive Manufacturing (TANIOBIS)
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  Low α Tin/Bismuth for Soft Error Reduction
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  Electroless UBM Formation Service
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  Via Filling Paste for Thermal Release / Low Specific Resistance and High Reliability Ag Bonding Wire(TATSUTA Electric Wire and Cable Co., Ltd.)
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  High-Purity Metals
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  Surface Treatment Agents for Metals (JX Metals Trading)

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  Via Filling Paste for Thermal Release / Low Specific Resistance and High Reliability Ag Bonding Wire(TATSUTA Electric Wire and Cable Co., Ltd.)
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  Negative Thermal Expansion Material: ZrW2O8
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  EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.)
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  EMC Shielding for Mighty Shield^® / Hybrid Shield Sheet
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  A New Contact Method by Metal Nanowire (NanoWired GmbH)
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  Lotus Metal with High-efficiency Heat Radiation（Lotus Thermal Solution）

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  YAG Ceramics for Laser Applications
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  Compound Semiconductor Wafers
  - InP, CdZnTe -
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  Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”

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  Sputtering Targets for Magnetic Devices

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  AlSc & K-Na-Nb(KNN) Sputtering Targets for Lead-free Piezo Devices
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  Tantalum and Niobium Oxides and Compounds (TANIOBIS)

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  Sputtering Targets for Functional Thin Films

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  Compound Semiconductor Wafers
  - InP, CdZnTe -

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  Extremely High-Strength Copper Titanium Foil C1995-GSH for Auto-focus camera module
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  C1990-GSH (CP) Copper-Plated High Strength Copper Titanium Foil
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  Sputtering Targets for Functional Thin Films
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  Tantalum and Niobium Oxides and Compounds (TANIOBIS)

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  Copper Ink for Fine Lines with Printed Electronics

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  Metal Powders for Additive Manufacturing
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  AMtrinsic^® Powders for Additive Manufacturing (TANIOBIS)
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  Titanium Powder (Toho Technical Service Co., Ltd.)
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  ABD^®-900AM New Nickel Powder for Additive Manufacture (Alloyed)
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  Architectured Materials Additive Process Optimisation Technology (Alloyed)

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  Surface Treatment Agents for Metals (JX Metals Trading)

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  JX Advanced Metals Group Lithium-ion Battery (LiB) Activities
  -Centralized Promotion of Material Development and Recycling-
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  High Strength Rolled Copper Foil for Li-ion Battery
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  Lithium Ion Conducting Solid Electrolyte Lanthanum Lithium Titanate (LLTO)(Toho Titanium Co., Ltd.)
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  Niobium Precursors for Battery Applications（TANIOBIS）(TANIOBIS)

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  Magnetocaloric Spheres for Hydrogen Liquefaction Magnetic Refrigerator
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  Photocatalyst for Artificial Photosynthesis

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  Lineup of Highly Functional Copper Foils
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  Super Flex RA Foils (HA & HA-V2)
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  Electro-Deposited Copper Foil for FPC “JXEFL Series”
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  Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”
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  Hyper Grain^® “HG”Copper Foils with Enhanced Fine-pitch Capability
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  EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.)
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  YAG Ceramics for Laser Applications

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  Compound Semiconductor Wafers
  - InP, CdZnTe -
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  Strontium Titanate Single Crystals(Furuuchi Chemical)
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  Rutile Single Crystals(Furuuchi Chemical)

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  AlSc & K-Na-Nb(KNN) Sputtering Targets for Lead-free Piezo Devices
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  Tantalum and Niobium Oxides and Compounds (TANIOBIS)

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  High-Performance Copper Alloy Product Lineup
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  Copper Alloy with Excellent Electrical Conductivity and Heat Resistance
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  High Strength and High Electrical Conductivity Corson Alloy NKC8738 / NKC4419(HC)
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  Ultra-thin Corson Alloy Foil
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  Extremely High-Strength Copper Titanium Foil C1995-GSH for Auto-focus camera module
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  Copper Titanium Alloy with Excellent Electrical Conductivity
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  Surface Treatment Agents for Metals (JX Metals Trading)

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  Sn-Cu-PET Foil for Electromagnetic Shielding

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  Sputtering Targets for Functional Thin Films
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  Sputtering Targets for Semiconductors
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  EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.)
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  Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”
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  Hyper Grain^® “HG”Copper Foils with Enhanced Fine-pitch Capability

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  Sintering Copper Fine Powder