Electro-Deposited Copper Foil for FPC “JXEFL Series”
Summary
- ・An annealable copper foil with high elongation and top-class bendability as electro-deposited copper. Fine nodulation on the smooth surface of the base foil.
- ・Excellent peel strength for base film, despite low roughness.
Application Examples
Benefits for Customers
- JXEFL has larger grains than normal ED foil, and fewer grain boundaries mean less risk of cracking.
- JX offers both RA and ED copper foils for FPCs and can suggest the best solution for the customer.
- JX offers various thickness of foil to meet a range of customer requirements.
Grain Structure -Cross Section of Cu foil-
Various thickness lineup
Features of JXEFL
- JX can suggest suitable surface treatment to match customer’s request.
Nodule Side SEM
Transmission Loss
FAQ
What are examples of applications?
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The JXEFL series has widely been adopted in FPCs for electronic devices. For high-frequency applications, the electro-deposited copper foil has been used in combination with LCP.
What are the differences from competing products?
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JX offers various thicknesses. The foil offers top-class bendability and better high-frequency performance as electro-deposited copper.
What makes the foil capable of performing its function?
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Larger grains than normal ED foil and fewer grain boundaries mean less risk of cracking. Fine nodulation on the smooth surface enables high-frequency performance.
Can you provide samples?
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Yes, we can provide stand-alone samples of copper foil, but please note that it will be used as part of a copper clad laminate in actual usage.