Sintering Copper Fine Powder

Product Overview

A sintering type copper fine powder engineered with proprietary surface‑treatment technology.

  • Tunable particle size: controllable from submicron to micron ranges
  • Excellent dispersibility: dispersible in a wide variety of solvents
  • Low‑temperature sintering: achievable under a nitrogen atmosphere
  • High‑temperature sintering: also possible under nitrogen or water‑vapor (steam) atmospheres

Application Examples

  • Bonding for power semiconductors (die‑attach, package‑attach)
  • Conductive ink and paste: wiring / interconnects for printed electronics
  • Metallization and conductor patterns for LTCC and MLCC (LTCC: Low‑Temperature Co‑Fired Ceramic; MLCC: Multilayer Ceramic Capacitor)

Key Features of Copper Fine Powder

  • Extensive particle‑size lineup available
  • Application‑tailored options: we can propose copper fine powders engineered to sinter at different temperature windows across various particle‑size grades

Copper fine powder overview

D500.15 μm
(SSA：4.6 m2/g)		0.31 μm
(SSA：2.4 m2/g)		0.92 μm
(SSA：0.7 m2/g)
SEM image
× 20k
C wt%0.240.180.09
O wt%0.670.590.36

Example: Using TYPE‑L Copper Fine Powder as a Copper Bonding Material for Power Semiconductors

  • The low‑temperature‑sintering TYPE‑L copper fine powder can be used both as a copper paste for conductive wiring and as a copper bonding material for power semiconductor applications.
  • When used as a bonding material, pressure sintering under a nitrogen atmosphere achieves uniform bonding to the backside of the semiconductor chip and delivers high bond strength.

Materials Used

Si dummy chip: 3 mm × 3 mm, t = 625 μm; backside metallization: Ag or Au
Cu substrate: 20 mm × 40 mm, t = 3 mm

Sintering Conditions

Stencil printing → Pre‑drying: 80 °C, 10 min, in air → Sintering: 250 °C, 15 MPa, 5 min, under N2

Back MetalAgAu
Cross sectional SEM image
Die shear strength (MPa)>74*>53*

*Chip breakage

Frequently Asked Questions (FAQ)

In what form is the product supplied?

We supply the product as powder sealed in aluminum pouches (aluminum packs).

What quantities are available?

We can supply from tens of grams up to 100 kg per month. We are also expanding our production capacity to accommodate future scale‑up.

Can you customize particle size (and related specifications)?

Yes. Our manufacturing process allows flexible customization of copper fine powder, so we can tailor particle size and other specifications to your requirements.

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