Sintering Copper Fine Powder

Summary

Submicron size sintered copper powder that can control the sintering temperature by surface treatment.

Application Example

It can be used for internal and external electrodes for fine wiring of laminated ceramic products.
In addition, it can be used as a bonding material or heat dissipation material that utilizes thermal conductivity better than solder.

Benefits for Customers

Sintering behavior of Cu（Typical example）

Resistivity of Sintered Cu(N2 Atmosphere)

Type H-1 Type H-2
Resistivity(μΩ・cm) 1.9 2.7

Sintering behavior at each temperature

Features of JX Cu Fine Powde

  • We have an extensive lineup of particle sizes.
  • It is also possible to propose copper fine powder with different sintering temperatures depending on the application.

Representative example

Size example
Specific
surface area		 1.5～4.5 m2/g
BET value 0.15～0.45 µm

If you desire a particular size,
please contact us.

FAQ

Do you support custom grain sizes and sintering temperatures?

It is possible to consider grain sizes, sintering temperatures, etc. according to your requests. Please contact us.

What kind of applications are you envisioning?

Conductive paste for LTCC is anticipated, but we are also considering other applications, so please feel free to contact us.

Are samples available?

We offer samples upon request.

Other products related to High-Functional Materials for Next Generation Devices

JapaneseEnglish