Under development

Printed Electronics Copper ink

Product Overview

  • As a sintering material type, it exhibits low electrical resistivity and high thermal conductivity.
  • Excellent printability enables the formation of highly linear printed wiring patterns and uniform coated surfaces.
  • Outstanding adhesion to various substrates.
  • Low resistivity can be achieved at low temperatures under controlled atmospheres such as nitrogen or superheated steam, etc.
  • Because we develop and manufacture copper raw materials, copper powders, and copper inks in‑house, we maintain a robust supply chain and can design products tailored to customer requirements.

Copper ink Overview

Key Features of Copper ink

  • Low‑resistance wiring can be formed by low‑temperature sintering under a nitrogen or superheated‑steam atmosphere.

Representative conductivity of Copper ink

Sintering condition200℃/ 30 min230℃/ 30 min200℃/ 30 min
AtmosphereN2N2Superheated steam
Sheet resistivity4.9 mΩ/□
(23.6 µm thickness)		3.6 mΩ/□
(18 µm thickness)		8.4 mΩ/□
(9.1 µm thickness)
Volume resistivity11.4 μΩ·cm6.4 μΩ·cm​​7.6 μΩ·cm​​

Printability of Copper ink

  • Enables formation of copper fine‑line patterns with L/S = 10/10 µm by screen offset printing—beyond the capability of screen printing.
  • As a fully additive, etch‑free and plating‑free process, it helps to reduce environmental impact.
  • Screen‑offset printing enables L/S = 100/100 µm printed wiring across a 200 µm step height—unachievable with conventional screen printing.

Copper ink adhesion

  • Exhibits strong adhesion to common flexible substrates.

Test conditions
Substrate: polyimide (PI)
Sintering: 250 °C for 30 min under a nitrogen atmosphere
Cross‑cut (crosshatch) adhesion test: in accordance with JIS K 5400‑8.5 (JIS D 0202)

Adhesion classification: 0 (good adhesion)

High‑Frequency Performance

  • Sintered copper obtained from the copper ink suppresses transmission loss even at high frequency.
    It is promising for applications where interconnect transmission loss at high frequency is a critical challenge.
※Normalized conductivity (101% IACS Copper=1)

Relative conductivity from resonant frequency measurement using a Fabry–Pérot resonator
(DC four‑probe volume resistivity of the sintered copper from copper ink: 6.0 µΩ·cm).

Frequently Asked Questions (FAQ)

In what supply forms is the product available?

We can supply it in syringes and ointment jars, as well as other forms upon request.

What printing method do you recommend?

We recommend dispenser printing or screen printing. However, we can also tailor the ink and support other printing methods to meet customer specific requirements.

Other products related to High-Functional Materials for Next Generation Devices

JapaneseEnglish