Under development

Copper Ink for Fine Lines
with Printed Electronics

JX Metals-AIST Advanced Material and Technology for Future Society Cooperative Research Laboratory

Summary

Achieve full-additive fine line formation with L/S=10/10µm with copper ink and screen offset printing technology

Features of Copper Ink

  • Enables fine line formation according to the design value of the screen mask.
  • Excellent storage stability due to good dispersibility.
  • Low resistivity even at relatively low firing temperatures.
Sintering
method		 Temperature(℃)
/ Time (min.)		 Resistivity
(μΩcm)
Superheated steam
firing		 350 / 10
300 / 10		 4.2
10.0
Cool plasma sintering*1 250 / 30 3.3*2
  • *1
    N. Shirakawa et al., Jpn. J. Appl. Phys. 56, 05EB04 (2017)
  • *2
    Y. Kasashima et al., Jpn. J. Appl. Phys. 61, SE1001 (2022)

Benefits for Customers

  • Enables fine line formation with L/S=10/10 µm, which is difficult to achieve with screen printing.
  • Full-additive process does not use etchant or plating solution, which contributes to reduction of environmental impact.

Application Examples

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