C1990-GSH (CP)
Copper-Plated High Strength Copper Titanium Foil

Summary

Copper plating on conventional copper titanium foil C1990-GSH improves solder wettability and corrosion resistance.

Application Examples

Benefits for Customers

• Copper-plated copper titanium foil significantly improves solder wettability, contributing to higher assembly yields and reliability of camera modules.
• Even with Cu plating as thin as a few tenths of a micron, solder wettability is greatly improved, and has no affect on the thickness of the material.
• Cu plating increases corrosion resistance.

Features of C1990-GSH(CP)

• Along with high spring properties and high reliabilities of copper titanium foil, copper plating improves solder wettability and corrosion resistance.
  By thickening copper plating, electrical conductivity can be increased as well.

Other products related to High-Performance Copper Alloys

• High-Performance Copper Alloy Product Lineup
• High Strength and High Electrical Conductivity Corson Alloy NKC8738 / NKC4419(HC)
• Extremely High-Strength Copper Titanium Foil C1995-GSH for Auto-focus camera module
• Copper Alloy with Excellent Electrical Conductivity and Heat Resistance
• Ultra-thin Corson Alloy Foil
• Copper Titanium Alloy with Excellent Electrical Conductivity