Negative Thermal Expansion Material: ZrW2O8
Summary
We are developing ZrW2O8, a negative thermal expansion material that shrinks when heated. It is expected to contribute to improved reliability by alleviating thermal stress in electronic equipment and heat-generating parts used in environments with temperature changes.
Application Examples

Benefits for Customers
- Since ZrW2O8 has negative thermal expansion property, the thermal expansion of composite materials with ZrW2O8 can be relaxed.
- ZrW2O8 can be mixed with both organic and inorganic substances.
- Since the coefficient of thermal expansion is proportional to the mixing ratio of ZrW2O8 when ZrW2O8 is dispersed properly, the coefficient of thermal expansion can be controlled easily.
- ZrW2O8 shows negative thermal expansion property in a wide temperature range.
- Development of finer particle is on going for higher dispersibility.
Effect Image of ZrW2O8 Mixed with Organic Substrate

CTE: Coefficient of Thermal Expansion
TMA Measurement Result of Epoxy Resin with ZrW2O8

Negative Thermal Expansion Property of ZrW2O8
TMA Measurement Result*

Temperature(℃)
Phase | CTE (ppm/K) | Temp. Range (℃) |
---|---|---|
α-phase | -9 | ~ 155 |
α→β phase change | - | 155 ~ 180 |
β-phase | -4 | 180 ~ |
*) Measured with a green compact(density:65%)
Mechanism of Negative Thermal Expansion

FAQ
Are ZrW2O8 samples available?
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We are considering proposing samples upon request. Please feel free to contact us.
What kind of applications are you considering?
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ZrW2O8 is being considered for various applications including semiconductor packaging materials such as sealing materials, structures used in high- and low-temperature environments, and adhesives joining dissimilar materials.
Is it a conductive material?
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It is an electrically insulating material and can be considered as a filler for materials that require insulation.