Hyper Grain® “HG”Copper Foils with Enhanced Fine-pitch Capability
Summary
- Recrystallized fine grain for better fine pitch wiring.
- Excellent circuit linearity and affinity for soft-etching patterning.
- Excellent handling ability due to high stiffness regardless of the foil's thinness.
- High elongation property due to homogeneous deformation without constriction, resulting in superior bendability.
Application Examples
Concept of this Material – Fine pitch capability -
- Linearity and soft-etching are superior because of its recrystallized fine grain.
- The combination of HG and BHM surface treatment is the most suitable for leading-edge fine line applications.
Technical superiority compatible with fine-pitch capability
- HG has good flexibility because of its uniform elongation.
Flexibility
FAQ
What are examples of applications?
-
Hyper Grain® "HG" copper foils have been adopted in FPCs for high-frequency applications and fine pitch circuit patterning uses.
What are the differences from competing products?
-
As a material for FPCs, HG can achieve superior bendability and excellent circuit linearity.
What makes HG capable of performing its function?
-
Its recrystallized fine grain.
Can you provide samples?
-
Yes, we can provide stand-alone samples of copper foil, but please note that it will be used as part of copper clad laminate in actual usage.