Search by Application
You can search for the product you are looking for by application.
HDD
Advanced LSI / Memory
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Sputtering Targets for Semiconductors -
AMPERTEC® High-Purity Chlorides (TANIOBIS) -
Low α Tin/Bismuth for Soft Error Reduction -
Electroless UBM Formation Service -
Via Filling Paste for Thermal Release / Low Specific Resistance and High Reliability Ag Bonding Wire(TATSUTA Electric Wire and Cable Co., Ltd.) -
High-Purity Metals -
Surface Treatment Agents for Metals (JX Metals Trading)
ECU / Electronic Module
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Via Filling Paste for Thermal Release / Low Specific Resistance and High Reliability Ag Bonding Wire(TATSUTA Electric Wire and Cable Co., Ltd.)
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Negative Thermal Expansion Material: ZrW2O8 -
EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.) -
3D-formable Sheets for Electromagnetic Shielding -
A New Contact Method by Metal Nanowire (NanoWired GmbH) -
Lotus Metal with High-efficiency Heat Radiation（Lotus Thermal Solution）
Millimeter-wave Radar / LiDAR
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YAG Ceramics for Laser Applications -
Compound Semiconductor Wafers
- InP, CdZnTe - -
Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”
Magnetic Sensor
Pressure Sensor
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AlSc & K-Na-Nb(KNN) Sputtering Targets for Lead-free Piezo Devices -
Tantalum and Niobium Oxides and Compounds (TANIOBIS)
Optical Sensor
Radiologic Exam
Camera
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Extremely High-Strength Titanium Copper Foil C1995-GSH for Auto-focus camera module -
Sputtering Targets for Functional Thin Films -
Tantalum and Niobium Oxides and Compounds (TANIOBIS)
Additive Manufacturing
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Metal Powders for Additive Manufacturing -
AMtrinsic® Powders for Additive Manufacturing (TANIOBIS) -
Titanium Powder (Toho Technical Service Co., Ltd.) -
ABD®-900AM New Nickel Powder for Additive Manufacture (Alloyed) -
Architectured Materials Additive Process Optimisation Technology (Alloyed)
High Precision Stamping and Plating
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Stamping Work ・ Insert Molding Work -
High Precision Saving Gold 3D Multiple Plating® Products -
Surface Treatment Agents for Metals (JX Metals Trading)
Lithium Ion Battery
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JX Metals Group Lithium-ion Battery (LiB) Activities
-Centralized Promotion of Material Development and Recycling- -
High Strength Rolled Copper Foil for Li-ion Battery -
Lithium Ion Conducting Solid Electrolyte Lanthanum Lithium Titanate (LLTO)(Toho Titanium Co., Ltd.) -
Tab Leads for Pouch Type Battery -
Niobium Precursors for Battery Applications（TANIOBIS）(TANIOBIS)
Hydrogen Generation
Flexible Printed Circuit Board
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Lineup of Highly Functional Copper Foils
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Super Flex RA Foils (HA & HA-V2)
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Electro-Deposited Copper Foil for FPC “JXEFL Series” -
Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”
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Hyper Grain® “HG”Copper Foils with Enhanced Fine-pitch Capability -
EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.)
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YAG Ceramics for Laser Applications
Optical Communication
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Compound Semiconductor Wafers
- InP, CdZnTe - -
Strontium Titanate Single Crystals(Furuuchi Chemical) -
Rutile Single Crystals(Furuuchi Chemical)
SAW Filter
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AlSc & K-Na-Nb(KNN) Sputtering Targets for Lead-free Piezo Devices
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Tantalum and Niobium Oxides and Compounds (TANIOBIS)
Connector
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High-Performance Copper Alloy Product Lineup -
High Strength and High Electrical Conductivity Corson Alloy NKC8738 / NKC4419(HC) -
Extremely High-Strength Titanium Copper Foil C1995-GSH for Auto-focus camera module
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Stamping Work ・ Insert Molding Work
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High Precision Saving Gold 3D Multiple Plating® Products
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Surface Treatment Agents for Metals (JX Metals Trading)
Cable
Display
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Sputtering Targets for Functional Thin Films
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Sputtering Targets for Semiconductors
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EMI SHIELDING FILM Line-up Solution for Designing Noise Counter Measures (TATSUTA Electric Wire and Cable Co., Ltd.)
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Copper Foil for Fine Pitch & High Frequency Performance “BHM Treatment”
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Hyper Grain® “HG”Copper Foils with Enhanced Fine-pitch Capability
