Under development
ED Copper Foil with High EF (Etch Factor) for Subtractive Etching
Summary
Enables rectangular circuit formation by subtractive etching of copper foil (without copper plating).
Application Examples
Excellent performance as a copper foil for inner layers of multilayer boards, build-up boards, button-plated circuits, etc.
Benefits for Customers
- High EF ➡ Good impedance control with rectangular cross section
- High EF × fine line ➡ Lighter weight and lower cost due to reduced number of layers
- High EF × thick foil ➡ Improved heat dissipation by increasing the cross-sectional area
- Lower cost with subtractive etching
Current Development Stage
- In laboratory-scale development stage.
- Provision of samples to be discussed on request.
- High volume production expected around FY2026.
| Item | Contents |
|---|---|
| Foil type & thicknesses | ED foil 9 ~ 70 μm |
| Foil properties | Roughness, peel strength, mechanical properties, reliability, etc. are equivalent to conventional foils’ |