Surface Treatment Agent for Hybrid Bonding(JX Metals Trading)

Summary

JX Metals Trading’s Semiconductor Materials Division serves as the JX Advanced Metals Group’s sole development and manufacturing base for surface treatment agents.
We provide comprehensive support, including product development and analysis tailored to each customer’s requests.

We are currently developing the "SQ Series“, a specialized surface treatment agents for Cu electrodes in semiconductor chips.
This agent offers 2 benefits; removing Cu-oxide and forming a protective coating that prevents oxidation of pure Cu electrodes.
In Hybrid Bonding, the surface condition of Cu electrodes is critically linked to the semiconductor performance. The SQ Series contributes to improved bonding reliability by ensuring optimal surface preparation.

Application Examples

Properties of SQ Series

  • Removing Cu-oxide of the Cu surface and forming long-term protection coating against re-oxidation.
  • Selective adsorption on Cu pad. (DI water cleaning needed )
  • Decomposed by plasma ensuring no adverse impact on the bonding process.

Benefit on Hybrid Bonding process

  • Enhancement of Cu electrode bonding reliability and process stability
  • Enhancement of electrical characteristics
  • Extended Queue Time so good fit for the processes which has a longer processing time (Application Example: D2W Bonding)
Figure:Cross-sec. SEM image obtained for the chip-to-chip HB die

Cu-Oxide Removal Capability

  • Reduce the oxide thickness from 2.5 nm to below 1 nm.
Figure:XPS depth profiles/Cu on Si wafer：R.T, 30～40%RH, 4weeks

Protective Layer Capability

  • Compared to No treatment, it suppresses the formation of re-oxidation in high-temperature and high-humidity environments.
Figure : XPS depth profiles/Cu on Si wafer：85℃, 85%RH, 4h

FAQ

Are SQ Series samples available?

Yes, we can propose the sample tailored to your request. Please feel free to contact us.

Is spin coating possible?

Yes, as this agent is a water-based solution.

Does the product contain PFAS?

No, it does not contain PFAS. We have selected non-fluorinated materials, ensuring compliance with both domestic and international regulations.

What are the removal conditions by plasma?

We have confirmed that it can be removed using N2 plasma at 200W for 10 seconds.
※ Conditions depend on the equipment.

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